Electronic insulating material

Mainly used for semiconductor components and electronic equipment, insulation protection. ① printed circuit board, that is, copper-coated version. Substrate for the resin laminated compressed wood, known as rigid copper clad version, often used epoxy, phenolic and other resin plate; substrate for the polymer film or single layer of heat-resistant glass cloth, said the flexible copper-clad version, Often used polyester, polyimide, fluoropolymer film. ② packaging materials used to prevent the outside world moisture and impurities on the impact of semiconductor components parameters. At present, about 90% of the semiconductor components used in plastic packaging. Mainly with epoxy resin and silicone resin, followed by phenolic resin, polyester, polybutadiene and so on. (3) Insulating film for semiconductor devices, a surface protective film (including a contact film, a passivation film, a moisture-proof shock film, an α-ray shielding film for preventing soft errors, etc.) of a semiconductor element such as a large-scale film integrated circuit, and an interlayer insulating film The Such as polyimide-based aromatic heterocyclic polymer.